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cp013

Single Workstation Wire Polishing Machine

Feature
Double pillar structure
Double guide structure guanrantee better vibration straightness
cp013
Product Description

Feature

Double pillar structure

Double guide structure guanrantee better vibration straightness

 

Specifications

Type

BDXP-G

Processing Scope

Φ0.5~Φ8.0 mm

Die Holder Max.Incline Angle

20°

Power Supply Voltage

AC 220 V,50 Hz

Total Power

<100 W

Dimension(Length×Width×Height)

600mm×600mm×550mm

Net Weight

About 100kg

 

Main Features

The driver system uses pulse width modulation technology; Ideally designed for processing fine size;

Double pillar structure with better vertical adjusting capabilities;

High finished grinding basement with better central adjustment capability;

High strength casting structure achieve better performance on stability, precision and service life;

This universal machine is designed for shaping and polishing diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.

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CONTACT US

address

Address: Taoyuan Industrial Park, Plain County, Dezhou City