Precision Wire Polishing Machine

Main Features
The driver system uses pulse width modulation technology; Ideally designed for processing fine size ;
Double pillar structure with better vertical adjusting capabilities;
A longer working stroke with high production;
Easy operation, low vibration and long term usage;
This universal machine is designed for shaping and polishing fine size diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.

Product Description

Feature：

Designed for fine size dies manufacturing

Specifications

Type	BDWP-310
Processing Scope	Φ0.01～Φ1.0 mm
Die Holder Max.Incline Angle	30°
Power Supply Voltage	AC 220 V，50 Hz
Total Power	＜300 W
Dimension(Length×Width×Height)	250 mm×470 mm×600 mm
Net Weight	46 kg

Main Features

The driver system uses pulse width modulation technology; Ideally designed for processing fine size ;

Double pillar structure with better vertical adjusting capabilities;

A longer working stroke with high production;

Easy operation, low vibration and long term usage;

This universal machine is designed for shaping and polishing fine size diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.

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